TDG-Z11-SI-2C

Produktbild TDG-Zx-SI-2C-LV

TDG-Z11-SI-2C is a 2-part dispensable  silicone gap filler which is filled with thermally conductive fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place. It has a natural low level tack that enhances a good thermal contact.

PROPERTIES
  • Dispensable 2-part silicone
  • Thermal conductivity: 11,0 W/mK
  • Remains elastic after polymerisation
  • Zero stress on components
  • Heat accelerated curing
  • Shock absorbing
AVAILABILITY
  • Cartridges 2 x 25 ml / 2 x 200 ml / 2 x 600 ml
  • Pail 2 x 25 kg
APPLICATION EXAMPLES

Thermal link of:

  • FPBGA
  • Capacitors
  • Heat Pipes
  • BGA

For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs

OVERVIEW
PropertiesUnitA-PartB-Part
ColourGreenish GreyGrey
Density @ 25 °Cg/cm³3,303,30
Mixing RatioWeight or Volume1 : 11 : 1
Hardness Shore 005050
ViscosityPas220200
Viscosity (mixed)Pas210210
Pot Life @ 25 °C and 65 % RH (Time for viscosity to double)min40 – 9040 – 90
Curing Time @ 25 °C / 80 °CStunden / Minuten10 ±2 / ≥ 3010 ±2 / ≥ 30
Shelf Life (from Date of Manu- facturing, unopened, dry storage conditions @ –15 – 35 °C) Months99
Flammability (Equivalent)UL 94V0V0
RoHS Conformity2015 / 863 / EUYesYes
Technical
Thermal ConductivityW/mK1111
Operating Temperature°C- 40 to + 150 - 40 to + 150
Dielectric StrengthkV/mm≥ 7≥ 7
Volume ResistivityOhm-cm≥ 1 x 1012≥ 1 x 1012

您有任何问题吗?

/ 联系人
+49 (0)89 665 477-83
Phone 欢迎致电我们的团队。
我们很高兴能为您提供服务。

+49 172 348 76 08
Meet our experts 和我们的专业人士对话
免费网上咨询
Mail 请和我们联系。
yun.zhu@hala-tec.de
Download 下载数据信息