TDG-L-SI-2C-Y

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TDG-L-SI-2C-Y 2K Gap Filler dispensierbar

TDG-L-SI-2C-Y is a 2-part dispensable low volatile LV silicone gap filler which is filled with thermally conductive fillers. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place. It has a natural low level tack that enhances a good thermal contact. Due to its negligible and controlled volatile content it is suited for environments where volatile silicones and paint wetting impairment are critical.




PROPERTIES

  • Dispensable 2-part silicone
  • Low volatile siloxane content (LV)
  • No paint wetting impairment
  • Thermal conductivity: 2.0 W/mK
  • Remains elastic after polymerisation
  • Zero stress on components
  • Heat accelerated curing
  • Shock absorbing

AVAILABILITY

  • Cartridges 2 x 25 ml / 2 x 100 ml /
    2 x 200 ml / 2 x 600 ml
  • Pail 2 x 25 kg / 2 x 35 kg
  • On request

APPLICATION EXAMPLES

Thermal link of:

  • FPBGA
  • Capacitors
  • Heat Pipes
  • BGA

For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs

OVERVIEW

PropertiesUnitA-PartB-Part
MaterialSiliconeSilicone
ColourYellowWhite
Density @ 25 °Cg/cm³1.91.9
Mixing RatioWeight or Volume1 : 11 : 1
HardnessShore 005252
Viscosity (Brookfield @ 10 rpm, 25 °C)Pas260260
Viscosity (mixed) (Brookfield @ 10 rpm, 25 °C))Pas260260
Pot Life @ 25 °C and 65 % RH (Time for viscosity to double)min> 120> 120
Curing Time @ 25 °C / 100 °C< 24 h / 15-30 min< 24 h / 15-30 min
Shelf Life (from Date of Manufacturing, unopened, @ < 35 °C)Months66
No Paint Wetting Impairment Substances (PWIS)1YesYes
UL FlammabilityUL 94VOVO
RoHS Conformity2015 / 863 / EUYesYes
Technical
Thermal Conductivity2W/mK2.02.0
Operating Temperature Range°C- 50 to + 150 - 50 to + 150
Dielectric StrengthkV/mm> 10> 10
Volume ResistivityOhm-cm> 1 x 1010> 1 x 1010