TDG-Z10-SI-2C-LV

Produktbild TDG-Zx-SI-2C-LV

TDG-Z10-SI-2C-LV is a 2-part dispensable low volatile LV silicone gap filler which is filled with thermally conductive fillers. The special filler-matrix configuration enables good dispensability with high flow behavior given excellent thermal conductivity. After curing under heat the system remains elastic. It is characterised by very good dielectric and mechanic properties and is suited for compensating extreme tolerances and spaces at non-coplanar systems. Its thixotropic behaviour allows for a definite placement and cure-in-place. It has a natural low level tack that enhances a good thermal contact. Due to its negligible and controlled volatile content it is suited for environments where volatile silicones are critical.

PROPERTIES
  • Dispensable 2-part silicone
  • High flow behavior
  • Low volatile siloxane content (LV)
  • Thermal conductivity: 10.0 W/mK
  • Remains elastic after polymerisation
  • Zero stress on components
  • Heat accelerated curing
  • Shock absorbing
AVAILABILITY
  • Cartridges 2 x 25 ml / 2 x 200 ml / 2 x 600 ml
  • Pail 2 x 25 kg
APPLICATION EXAMPLES

Thermal link of:

  • FPBGA
  • Capacitors
  • Heat Pipes
  • BGA

For use in Automotive applications / Telecommunication / Multimedia / Industrial PCs

OVERVIEW
PropertiesUnitA-PartB-Part
ColourDark greyLight grey
Density @ 25 °Cg/cm³3,253,25
Mixing RatioWeight or Volume1 : 11 : 1
Hardness Shore 005555
ViscosityPas500500
Viscosity (mixed)Pas500500
Flow rateg/min1515
Pot Life @ RTMinutes~60~60
Curing Time @ 23 °C / 100 °CHours / Minutes< 24 / 30< 24 / 30
Shelf Life (from Date of Manufacturing, unopened, dry storage conditions @ ≤ 35 °C, < 75% RH) Months66
Flammability (Equivalent)UL 94V0V0
RoHS Conformity2015 / 863 / EUYesYes
Technical
Thermal ConductivityW/mK1010
Operating Temperature°C- 50 bis + 160- 50 bis + 160
Dielectric StrengthkV/mm> 6> 6
Volume ResistivityOhm-cm≥ 1 x 1013≥ 1 x 1013

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