TAD-U-SI-1C is a condensation curing, non-corrosive highly thermally conductive 1 part silicone adhesive. It vulcanises at room temperature (RTV) to a strong but still elastic rubber and exhibits excellent primerless adhesion to most surfaces. Due to rapid alcoxic curing while being in contact with atmospheric moisture it is solvent free. The adhesive features very high thermal conductivity and a thixotropic rheology that will prevent slumping or flow during the process. It allows for being operated at temperatures up to 230°C and does not corrode copper or its alloys when fully cured. It is characterised by high resistance to water, acids, bases and most organic solvents and is especially suitable for applications where very high thermal conductivity, adhesion, fast curing and controlled, precision application are essential.