PRODUCT OF THE MONTH – MAY 2026
TGF-Z12S-SI is our high-performance silicone gapfiller that truly shines when conventional thermalmanagement reaches its limits. With a thermal conductivity of 12 W/mK, it ensures extremely efficient heat dissipation—even with large gap dimensions and uneven components. Thanks to its soft, pliable structure, the material adapts perfectly to any surface and establishes reliable thermal contact even with very low contact pressure. This reduces the overall thermal resistance while simultaneously protecting sensitive components from mechanical stress.
Whether in 5G base stations, automotive electronics, laptops medical technology or industrial computers – anywhere where performance, space constraints, and reliability converge – TGF-Z12S-SI enables stable and long-lasting thermal management. Thanks to its double-sided self-adhesive properties, the material can be easily pre-applied and efficiently integrated into existing assembly processes – as a mat or a precisely cut blank.
Ready to eliminate thermal bottlenecks in your design? Then let’s talk about how TGF-Z12S-SI can take your project to the next level:
+49 7021 73141 79
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