PRODUCT OF THE MONTH – AUGUST 2026
TGF-JXS-SI-A1 is an ultra-soft thermal interface material (TIM) developed to deliver reliable heat dissipation across larger gaps and irregular component surfaces. With its high thermal conductivity, it ensures consistent thermal performance while minimizing mechanical stress on sensitive electronic assemblies. It is extremely soft and allows the material to conform easily to varying component heights, manufacturing tolerances, and uneven surfaces. Even at very low compression forces, TGF-JXS-SI-A1 creates an effective thermal path, helping to reduce overall thermal resistance and improve long-term system reliability. A key advantage is its Low Volatile Siloxane (LV) formulation, making it a suitable choice for applications where contamination-sensitive components and long-term stability are critical. In addition, the material offers excellent chemical resistance and durability under demanding operating conditions.
Whether used in automotive, electronics, laptops, medical technology, embedded systems, industrial electronics, or communication equipment, TGF-JXS-SI-A1 helps engineers solve thermal challenges caused by large tolerances and complex assemblies. The material’s tackiness and one-sided self-adhesive construction enable fast pre-assembly and seamless integration into production processes, whether supplied as sheets or precision die-cut parts. Looking for a flexible gap filler solution to improve your thermal management design? Let’s discuss how TGF-JXS-SI-A1 can support your next project. +49 7021 73141 79
Want to dive deeper? Check it out here:
