PRODUCT OF THE MONTH – JUNE 2026
TDG-Z8-SI-2C is a dispensable, two-component, silicone-based gapfiller that we have developed specifically for demanding applications in modern thermal management. With its high thermal conductivity of 8.0 W/mK, the material ensures reliable heat dissipation – even with large tolerances and non-planar surfaces.
Thanks to its thixotropic behavior, our gap filler can be precisely applied using the form-in-place process and cures particularly quickly when heated. The material remains elastic, dampens vibrations, and reduces mechanical stress on sensitive components. This is precisely why TDG-Z8-SI-2C is ideal for applications in automotive electronics, telecommunications, industrial computers, or multimedia systems – such as for the thermal interface of Ball Grid Array (BGA) packages, Fine Pitch Ball Grid Array (FPBGA), capacitors, or heatpipes. Particularly convenient for integration into existing processes: TDG-Z8-SI-2C is available in various cartridge sizes as well as in bulk containers, thereby enabling maximum flexibility—from prototyping to series production.
Are you looking for a high-performance solution for complex thermal requirements? Then let’s work together to find the right material solution for your project. For a personal consultation, call +49 7021 73141 79
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