When it comes to gentle pressure – in the truest sense of the word – our TGF-RUS-SI-A1 is exactly the right material: a particularly soft, surface compliable silicone-based gap filler that is ideal for large gaps, uneven surfaces or sensitive components. With a thermal conductivity of 3.0 W/mK, it ensures a reliable thermal connection even with very low contact pressure – without mechanically stressing electronic components.

Whether in graphicscards, memorymodules, embeddedboards, notebooks, LCD/plasmaTVs or medicaltechnology – the TGF-RUS-SI-A1 supports effective thermal management when long-lasting performance and reliable heat dissipation are required. Thanks to its one-side natural adhesion, it can be easily pre-applied, is vibration-damping, chemically resistant and optionally available with a PI film laminate for even greater mechanical stability. The TGF-RUS-SI-A1 is available in thicknesses from 1 to 5 mm and in various delivery forms – as sheet, kiss-cut sheet or individual part – and can therefore be flexibly integrated into a wide range of applications.

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