TDG-Y-SI-2C is a two-component siliconegapfiller with a thermal conductivity of 6 W/mK that adapts perfectly to uneven surfaces and large tolerances. A special feature: even after curing, it remains elastic and relieves stress on sensitive components – for reliable performance without thermal bottlenecks.

Whether in automotive control units, 5G base stations, graphicsprocessors and consoles, notebooks, or embedded systems, TDG-Y-SI-2C ensures reliable heat dissipation and long-lasting functionality in all cases. The two-component silicone gap filler can be applied precisely using the form-in-place process, adheres easily for pre-assembly, and cures quickly when heat is applied – cleanly, efficiently, and robustly.

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