/ NEWS

PRODUCT OF THE MONTH – NOVEMBER 2025


TGF-RUS-SI-A1 is our particularly soft silicone gapfiller, which adapts perfectly to uneven surfaces and large tolerances. At the same time, it ensures a secure thermal connection. Even with very low contact pressure, it ensures efficient thermalmanagement – without mechanical stress on the components.

This makes our silicone gap filler ideal for use in systems with sensitive components: in graphicscards, consoles, embeddedboards, medicalelectronics, or high-end notebooks, it ensures that heat is dissipated cleanly even with narrow gap dimensions.

The TGF-RUS-SI-A1 can be pre-assembled thanks to its natural adhesion, is durable, and chemically stable. Available in various thicknesses and as mats, kiss-cut sheets, or individual pieces, it is flexible enough to fit seamlessly into your processes and stands out for its excellent price/performance ratio.

For individual advice, you can reach us at: +49 7021 73141 79

Explore TGF-RUS-SI-A1

 

Product of the Month November 2025: TGF-RUS-SI-A1 Operating Temperature: Range -50 to +150°C, Thermal conductivity: 3 W/mK, Hardness: 40 Shore 00

Product of the Month November 2025: TGF-RUS-SI-A1, Silicone Gap filler pad

Phone 欢迎致电我们的团队。
我们很高兴能为您提供服务。

+49 172 348 76 08
Meet our experts 和我们的专业人士对话
免费网上咨询
Mail 请和我们联系。
yun.zhu@hala-tec.de
Download 下载数据信息