Whether in high-end servers, 5G base stations, gaming rigs or PlayStations – wherever high performance is required, a lot of heat is generated. This means reliable thermalmanagement is not a nice-to-have, but a must!

Our TGF-Z10P-SI gapfiller made of silicone-based ceramic composite has an impressive thermal conductivity of 10 W/mK – ideal for applications with high power requirements and large gaps, for example due to uneven component heights or manufacturing tolerances.

Its surface compliance ensures optimum contact with low pressure – perfect for sensitive components such as GPUs, CPUs or capacitors.

Particularly strong for:

• Servers & data centers
• 5G infrastructure
• Gaming & consumer electronics (e.g. PlayStation, high-end graphics cards)
• Industrial computers & notebooks

Thanks to its natural adhesion, TGF-Z10P-SI is easy to pre-apply, available in various thicknesses (1 to 3 mm) and delivery forms – from mats to die-cut parts to kiss-cuts.

Want to know how it works in your project?
Let’s talk! We’ll be happy to advise you personally. +49 7021 73141 79

Does that sound exciting? Wait and see – click here to go to the product overview: https://www.hala-tec.de/produkte/gap-filler/silikon/