PRODUCT OF THE MONTH – MARCH 2026
Our TGF-BXS-SI is an ultra-soft, electrically insulating silicone gap filler with a thermal conductivity of 1.2 W/mK, which establishes efficient thermal contact between components and cooling structures even under minimal pressure. Thanks to its extreme softness and high conformability, it reliably closes larger gaps and tolerances – without any mechanical stress on the components. Its naturally adhesive material is very easy to pre-apply, and it is optionally available with a single-sided adhesive layer.
TGF-BXS-SI is ideal for sensitive components such as SMD components, through-hole vias, or capacitors that require thermal bonding in areas such as automotive, notebooks, medical technology, or industrial computers. Its elastic properties also dampen vibrations and increase the reliability of your system.
Large gaps, sensitive components, or tight installation spaces? Let’s work together to design the optimal solution.
We look forward to your call: +49 7021 73141 79
