TFO-Q-SI is an electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a very high thermal conductivity is reached. Under pressure the total thermal resistance is minimised. The material is characterised by its very high dielectric properties. The fibreglass reinforcement provides for an outstanding mechanic stability and cutthrough resistance as well as easy handling. For an easy and reliable preassembly the interface material is available with low tack pressure sensitive adhesive on one side.