TPC-R-AL is an aluminium film which is coated with a thermally conductive phase changing compound on both sides thus optimising the thermal path e.g. between electronic packages and heat sinks. During warm-up the phase change coating starts filling up surface-specific roughnesses and unevenesses and expels any air enclosures from micro structures even at low pressure. The wettening of the contact areas is further on improved by volumetric material expansion at increasing temperature. Thus the total thermal resistance is minimised. The aluminium carrier effects high mechanical stability and easy handling.