TCR-H-SI-2C

Kontakt 联系方式 Download 下载 TCR-H-SI-2C Data Sheet Muster 样品订购


TCR-H-SI-2C

TCR-H-SI-2C is a 2-part addition cure silicone potting compound which is filled with thermally conductive fillers of high temperature stability. It is characterised by very good dielectric and mechanic properties and is suited for encapsulating electric and electronic parts such as transformators, capacitors, inductors, sensors, LEDs and can be moulded or dispensed under normal conditions at room temperature or in vacuum. Its rheologic behaviour allows for usage in geometries that are difficult to access.




PROPERTIES

  • Silicone
  • Low viscosity
  • 2 part addition cure
  • Thermal conductivity: 1.2 W/mK
  • Almost zero stress on components
  • Dispensable or mouldable
  • Heat accelerated curing
  • High resistivity against water and humidity
  • Shock absorbing

AVAILABILITY

  • 2 kg / 10 kg (2 x 5 kg) AB Kit

APPLICATION EXAMPLES

Thermal link of

  • Inductors
  • Capacitors
  • Heat Pipes
  • BGA

For use in Automotive applications / Telecommunication / Controlling units / Industrial PCs

OVERVIEW

PropertiesUnitA-PartB-Part
MaterialSiliconeHardener
ColourLight greyOrange
Density @ 23 °Cg/cm³2,22,2
Mixing RatioWeight or Volume1 : 11 : 1
Hardness (7 days @ ~23 °C and 50% rel. F.)Shore A4040
Viscosity (Brookfield)Pas21.9
Viscosity (Mixed) (Brookfield)Pas1,951,95
Tensile Strength (7 days @ ~23 °C and 50% rel. F.)psi0,810,81
Elongation at Break (7 days @ ~23 °C and 50% rel. F.)%3030
Tear Strength (7 days @ ~23 °C and 50% rel. F.)kN/m4,564,56
Young Modulus (7 days @ ~23 °C and 50% rel. F.)psi4,984,98
Coefficient of Thermal Expansion (7 days @ ~23 °C and 50% rel. F.)
Volumetric1 x 10-6 /K402402
Linear1 x 10-6 /K134134
Linear Shrinking (7 days @ ~23 °C and 50% rel. F.)%0.030.03
Pot Lifeminca. 50ca. 50
Curing Time @ 25 °C / 100 °C 4 Stunden / 6 Minuten4 Stunden / 6 Minuten
Shelf Life (from Date of Manufacturing, unopened @ < 30 °C)Months1212
UL FlammabilityUL 94V0 (5,6 mm)V0 (5,6 mm)
RoHS Conformity2015 / 863 / EUYesYes
Technical
Thermal ConductivityW/mK1.21.2
Operating Temperature Range°C- 70 bis + 250- 70 bis + 250
Dielectric StrengthkV/mm1414
Volume ResistivityOhm-cm1,8 x 10141,8 x 1014
Dielectric Constant@ 1 kHz4,534,53