TFO-L-SI

TFO-L-SI is an electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a high thermal conductivity is reached. Its conformal surface structure guarantees a very good compliance to the contact surfaces even at low pressure. Thus the total thermal resistance is minimised. The material can be applied in a broad field of applications.
- Thermal conductivity: 2.1 W/mK
- Very good surface compliance
- Very low thermal resistance
- Extraordinary chemical resistance and longterm stability
- Residue-free removal after use
- Sheet 440 x 480 mm
- Non tacky
(TFO-LXXX-SI) - Die cut parts
Thermal link of:
- MOSFETs or IGBTs
- Power diodes or AC/DC converters
- Power modules
For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems
Properties | Unit | TFO-L200-SI | TFO-L300-SI | TFO-L450-SI | TFO-L800-SI |
---|---|---|---|---|---|
Material | Ceramic filled silicone | Ceramic filled silicone | Ceramic filled silicone | Ceramic filled silicone | |
Colour | Grey | Grey | Grey | Grey | |
Reinforcement | None | None | None | None | |
Thickness | mm | 0,20±0,05 | 0,30±0,05 | 0,45±0,05 | 0,80±0,05 |
Tensile Strength1 | psi | 3 | 3 | 3 | 3 |
UL Flammability | UL 94 | VO | VO | VO | VO |
RoHS Conformity | 2015 / 863 / EU | Yes | Yes | Yes | Yes |
Thermal | |||||
Resistances2 @ 150 PSI | °C-inch²/W | 0.30 | 0.35 | 0.41 | 0.55 |
Resistance2 @ 30 PSI | °C-inch²/W | 0.50 | 0.56 | 0.59 | 0.71 |
Thermal Conductivity | W/mK | 2.1 | 2.1 | 2.1 | 2.1 |
Operating Temperature Range | °C | - 50 to + 200 | - 50 to + 200 | - 50 to + 200 | - 50 to + 200 |
Electric | |||||
Breakdown Voltage3 | kV AC | 3 | 5 | 8 | 9 |
Volume Resistivity | Ohm - cm | 1.5 x 1013 | 6.0 x 1013 | 5.4 x 1013 | 7.7 x 1013 |
Dielectric Constant | @ 1 MHz | 5.5 | 5.5 | 5.5 | 5.5 |