TFO-L-SI

TFO-L-SI Silikonfolie glasfaserverstärkt

TFO-L-SI is an electrically insulating thermally conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. Through the specific formulation and filling with thermally conductive ceramic particles a high thermal conductivity is reached. Its conformal surface structure guarantees a very good compliance to the contact surfaces even at low pressure. Thus the total thermal resistance is minimised. The material can be applied in a broad field of applications.

PROPERTIES
  • Thermal conductivity: 2.1 W/mK
  • Very good surface compliance
  • Very low thermal resistance
  • Extraordinary chemical resistance and longterm stability
  • Residue-free removal after use
AVAILABILITY
  • Sheet 440 x 480 mm
  • Non tacky
    (TFO-LXXX-SI)
  • Die cut parts
APPLICATION EXAMPLES

Thermal link of:

  • MOSFETs or IGBTs
  • Power diodes or AC/DC converters
  • Power modules

For use in Switch mode power supplies / Motor control units / Automotive engine management systems / UPS units / Solar systems

OVERVIEW
PropertiesUnitTFO-L200-SITFO-L300-SITFO-L450-SITFO-L800-SI
MaterialCeramic filled siliconeCeramic filled siliconeCeramic filled siliconeCeramic filled silicone
ColourGreyGreyGreyGrey
ReinforcementNoneNoneNoneNone
Thicknessmm0,20±0,050,30±0,050,45±0,050,80±0,05
Tensile Strength1psi3333
UL FlammabilityUL 94VOVOVOVO
RoHS Conformity2015 / 863 / EUYesYesYesYes
Thermal
Resistances2 @ 150 PSI°C-inch²/W0.300.350.410.55
Resistance2 @ 30 PSI°C-inch²/W0.500.560.590.71
Thermal ConductivityW/mK2.12.12.12.1
Operating Temperature Range°C- 50 to + 200 - 50 to + 200 - 50 to + 200 - 50 to + 200
Electric
Breakdown Voltage3kV AC3589
Volume ResistivityOhm - cm1.5 x 1013 6.0 x 10135.4 x 1013 7.7 x 1013
Dielectric Constant@ 1 MHz5.55.55.55.5

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